Precision Micro-Drilling for Semiconductor Manufacturing Equipment Vacuum Suction Transfer Plates | Shower Plates

We provide precision micro-drilling for resin and aluminum transfer plates used in semiconductor manufacturing equipment for data centers. In semiconductor manufacturing processes, jigs that vacuum-transfer wafers and films require extremely high precision.

Our micro-hole machining technology (hole diameters from 0.1 mm to 6.0 mm) enables high-accuracy drilling for filters, vacuum suction plates, and tooling used in semiconductor manufacturing equipment.

Materials Various resins,Teflon, Engineering plastics, Aluminum

Machining Specifications Hole diameter: 0.1–6 mm Pitch between hole walls: 0.1 mm and above (varies depending on material) Machining accuracy: ±0.05 mm (compared to design data values)

Please feel free to contact us regarding non-circular hole machining as well.